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Fanless Industrial Box PC
This Rugged Fanless CorBox is designed only for Mini-ITX motherboards. It has a traditional I/O shield on one side and can be customized to expose IO specified by customers on the opposite side. The top cover is a heat sink. The footprint of the box is 7” x 7”, giving the ability to mount in the most convenient orientation and then rotate the heat sink/top cover to achieve maximum efficiency.
| Form Factor | 7” x 7” x 2.4” (177.80mm x 177.80mm x 60.96mm) |
|---|---|
| Board Form Factor | Mini-ITX 170mm x 170mm (6.7” x 6.7”) |
| Processor | Intel® Atom E3845 |
| Memory | Supports DDR3L 1333MHz and DDR3L 1066MHz, Two (2) 204-pin DDR3L SODIMM sockets, up to 8GB system memory, dual channel memory interface |
| BIOS | AMI UEFI BIOS |
| I/O | One (1) x DVI-D connector on rear I/O One (1) RS232 port on rear I/O panel One (1) stacked RJ45/ dual USB 2.0 1 x stacked RJ45/USB 2.0 and 3.0 1 x SATA II connector 1 x SATA II shared with mSATA slot Port 80 Header |
| Expansion Slot | One (1) full length mini PCIe slot (Supports USB and PCIe signals) One (1) full length mSATA slot |
| Ethernet LAN | Two (2) Intel® I211AT PCI Express Gigabit Ethernet controllers |
| Graphics | Intel® HD Graphics, DVI-D 24-bit display port, resolution up to 2560×1600 @ 60Hz |
| Battery | Removable lithium battery for CMOS memory |
| Power | 12V DC 1A |
| Power Connectors | 4-pin Phoenix connector, Barrel connector |
| Temperature | Operating: 20°C to 60°C Non-Operating: 40°C to 85°C |
| Humidity | Operating: 5% to 95%, non-condensing Non-Operating: 5% to 95%, non-condensing |
Trusted in design and manufacturing of high quality industrial computing and IoT solutions for critical applications, from medical equipment to military system deployments.
Corvalent Corporation
1101 Arrow Point Drive, Building 501
Cedar Park, Texas 78613
