Due to current supply chain conditions, Corvalent Corporation and our manufacturing partners cannot guarantee product availability or pricing until the order is fulfilled and shipped.

Q60IX

Intel® Q670 Chipset Intel® 12th, 13th and 14th Gen core i3/i5/i7/i9

Corvalent Q60IX Isometric
Corvalent Q60IX Top

Engineered with precision to meet the rigorous demands of the industrial sector, the Q60IX motherboard redefines standards in data transfer, performance, and durability. With support for DDR5 memory, it delivers high-speed data throughput and exceptional responsiveness. The Q60IX is perfectly suited for use in semiconductor manufacturing, mission-critical systems, and medical applications.

Technical Specifications

Form FactorMini ITX170mm x 170mm (6.7’ x 6.7’)
Chipset/ProcessorChipsetIntel® Q670
CPUIntel® 12th, 13th, and 14th Gen 8 Bartlett Lake (series 2), up to 125W
SpeedN/A
TDPN/A
Core/ThreadsN/A
BIOSBIOSAMI® UEFI BIOS
Expansion SlotsPCI-Express1 x PCIex16 (4.0) (supports bifurcation)
MemoryDIMM2 x DDR5 5600MHz/4800 MHz SO-DIMM up to 64GB
GraphicsVGA1
HDMI11
DP1
Internal ConnectorsUSB3 x USB 2.0, 1 x USB 3.2 Gen. 1
Audio1 x front audio
SATA4 x SATA III
M.21 x M.2-M(2280), 1 x M.2-E (2230), 1 x M.2-B (3042), 1 x M.2-M (2240)
Serial Ports4 x RS232
GPIO1
Power1 x 24pin ATX, 1 x 4pin ATX12V
Other1 x SMBUS, 2 x PWM fans, 1 x Chassis Intrusion, 1 x LVDS
Rear I/OUSB6 x USB 3.2 Gen 2, 2 x USB 3.2 Gen 1, 2 x USB 2.0
Ethernet1 x 1GbE (i219) & 1 x 2.5GbE (i225-V)
Serial Ports1 x RS232/422/485, 1 x RS232
Audio1 x microphone jack
1 x speaker out jack
1 x line-in jack
PowerN/A
SecurityTPM 2.0NPCT750A
WatchdogProgrammable10 seconds-255 minutes
EnvironmentalOperating Temp0~60°C (32~140°F)
Non Operating Temp-20~85°C
Operating Humidity10%-90% relative humidity, non-condensing
ComplianceCertificationsFCC, CE, RoHS, LVD, REACH (designed to comply)
OrderingPart NumberQ60IX
Downloads and drivers
Download Q60IX Spec Sheet