Technical Specifications
This Rugged Fanless CorBox is designed only for Mini-ITX motherboards. It has a traditional I/O shield on one side and can be customized to expose IO specified by customers on the opposite side. The top cover is a heat sink. The footprint of the box is 7” x 7”, giving the ability to mount in the most convenient orientation and then rotate the heat sink/top cover to achieve maximum efficiency.
| Form Factor | 7” x 7” x 2.4” (177.80mm x 177.80mm x 60.96mm) |
|---|---|
| Board Form Factor | Mini-ITX 170mm x 170mm (6.7” x 6.7”) |
| Processor | Intel® Atom E3845 |
| Memory | Supports DDR3L 1333MHz and DDR3L 1066MHz, Two (2) 204-pin DDR3L SODIMM sockets, up to 8GB system memory, dual channel memory interface |
| BIOS | AMI UEFI BIOS |
| I/O | One (1) x DVI-D connector on rear I/O One (1) RS232 port on rear I/O panel One (1) stacked RJ45/ dual USB 2.0 1 x stacked RJ45/USB 2.0 and 3.0 1 x SATA II connector 1 x SATA II shared with mSATA slot Port 80 Header |
| Expansion Slot | One (1) full length mini PCIe slot (Supports USB and PCIe signals) One (1) full length mSATA slot |
| Ethernet LAN | Two (2) Intel® I211AT PCI Express Gigabit Ethernet controllers |
| Graphics | Intel® HD Graphics, DVI-D 24-bit display port, resolution up to 2560×1600 @ 60Hz |
| Battery | Removable lithium battery for CMOS memory |
| Power | 12V DC 1A |
| Power Connectors | 4-pin Phoenix connector, Barrel connector |
| Temperature | Operating: 20°C to 60°C Non-Operating: 40°C to 85°C |
| Humidity | Operating: 5% to 95%, non-condensing Non-Operating: 5% to 95%, non-condensing |
